Resonance Micro Technologies (RMT) is an early-stage company developing wafer-scale manufacturing processes for high-performance micro-mirrors, micro-cavities, and precision micro-optics critical to the emerging quantum economy. As quantum computing, sensing, and precision timing move from laboratory demonstrations to deployed systems, demand for manufacturable, high-performance optical components is accelerating across commercial, defense, and scientific markets. RMT addresses this need with technology developed under DARPA programs at Yale University. Its wafer-scale approach challenges traditional hand-crafted manufacturing while targeting the performance required by next-generation classical and quantum systems.

Essential Functions

The following essential functions may be performed with or without reasonable accommodation.

Photonic and Micro-Optic Design

• Design and simulate photonic integrated circuits and micro-optic structures, including waveguides, resonators, couplers, micro-mirrors, and micro-cavities, using mode solvers, FDTD or FEM tools, and optical design software.
• Produce mask layouts and design files, apply foundry and process design rules, and manage tape-outs to in-house and foundry partners.
• Design for manufacturability, alignment tolerance, and packaging, so that device geometry supports low-loss coupling and repeatable assembly.
• Compare measured results against models and use the comparison to improve the next design iteration.

Micro-Optic Packaging and Assembly

• Develop and execute packaging and assembly processes, including precision optical coupling and alignment, die and substrate attach, wafer-level or hybrid bonding, adhesives and epoxies, and electrical and thermal interfaces.
• Design packaged-device architectures (for example, butterfly-style packages) for thermal stability, mechanical robustness, and low optical loss.
• Qualify packaged devices through environmental and reliability testing, and feed results back to design and process.
• Build the fixtures, alignment procedures, and assembly SOPs needed to move from hand assembly toward repeatable, scalable production.
• Evaluate and manage external packaging and assembly partners where in-house capability is not the right fit.

Optical Characterization and Test

• Develop and perform optical characterization and laser spectroscopy of wafer-level and packaged devices, including loss, finesse, linewidth, coupling efficiency, and spectral response.
• Build and automate test setups and data-analysis scripts.
• Use characterization results to direct design and packaging refinements, and to flag process issues to the process engineering team.

Fabrication Support and Process Integration

• Work with the process engineering team and foundry partners to define device process flows and to translate design and packaging requirements into process requirements.
• Review fabrication run data and support yield improvement and failure analysis using structured methods such as design of experiments and root-cause analysis.

Documentation and Technology Transfer

• Maintain controlled design files, process flows, and assembly and test procedures so the technology is transferable, reproducible, and auditable.
• Support transfer of designs, packaging methods, and processes to external production and foundry partners.

Customer and Program Engagement

• Engage with customers and partners on technical requirements and capabilities, with this responsibility growing over time.
• Represent RMT technically with customers and government program offices on requirements, capabilities, and qualifications.

Other Duties

• Comply with export control (ITAR/EAR), safety, and cleanroom protocols; perform related duties as assigned.

Required Qualifications

• BS, MS, or PhD in Electrical Engineering, Physics, Applied Physics, Optical Engineering, Materials Science, or a closely related field, with at least 5 years of relevant experience for a BS, 3 years for an MS, or a PhD with research in integrated photonics, micro-optics, or precision optics.
• Demonstrated photonic design experience, including at least one device taken from design through fabrication and measurement, with proficiency in simulation (mode solver, FDTD, or FEM), optical design, and mask layout tools.
• Hands-on optical packaging or assembly experience, such as fiber or free-space coupling, precision alignment, bonding, adhesives, or die attach.
• Hands-on optical characterization experience with lasers, detectors, and spectral or loss measurements.
• Working knowledge of microfabrication and cleanroom processes (photolithography, reactive ion etching, and thin-film deposition) sufficient to design for manufacturability and to work effectively with process engineers.
• A rigorous, data-driven approach to design iteration, packaging development, and root-cause analysis.
• The ability to work independently and resourcefully in an early-stage environment.
• Strong written and verbal communication skills, including presenting technical results and qualification requirements to customers and government program offices.

Preferred Qualifications

• Experience with foundry-based PIC platforms (for example, silicon or silicon nitride), including PDKs, multi-project wafer runs, and tape-out.
• Photonics background in lasers and laser locking techniques (for example, Pound-Drever-Hall), and high-finesse optical cavities.
• Experience with wafer-level bonding, heterogeneous integration, and hermetic or butterfly packaging.
• Experience with thin-film optical coating processes and low-loss optics.
• Thermal and mechanical modeling (FEA) of packaged devices, and scripting in Python or MATLAB for design automation and data analysis.
• Experience with defense or government-funded programs and export-controlled work.

Physical Demands and Work Environment

• Regular on-site work in cleanroom and laboratory settings; extended periods of standing, microscope work, and fine manual work, including optical alignment and assembly.
• Must wear cleanroom garments and personal protective equipment 
• Work with hazardous chemicals, gases, lasers, and high-voltage equipment under established safety protocols.
• Occasional lifting of up to 25 lbs.
• Reasonable accommodation information appears under Notices below.
• Benefits and Compensation
• Base salary of $110,000 – $145,000 per year, paid on a salary basis, based on experience and demonstrated capability. Incentive stock options under RMT's board-adopted equity plan, subject to plan terms. RMT offers competitive health coverage, retirement plan, paid time off and company holidays. 

Notices

RMT is an equal opportunity employer. RMT does not discriminate in recruiting, hiring, or employment on the basis of any characteristic protected by applicable federal, state, or local law. Employment decisions are based on qualifications, merit, and business need.

RMT will provide reasonable accommodation to qualified individuals with disabilities, absent undue hardship.

Applicants must be legally authorized to work in the United States. RMT does not offer visa sponsorship for this position. Employment is contingent on verification of identity and work authorization (Form I-9). Offers of employment are contingent on satisfactory completion of a background check, conducted after a conditional offer is extended and in compliance with applicable law.

This job description is not a contract of employment. Employment with RMT is at-will. Duties may change based on business needs.